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ADVANCED INTEGRATED CIRCUIT PACKAGING
Paras Defence arm to set up ₹6,200 crore semiconductor packaging facility in Madhya PradeshParas Semiconductors is set to invest ₹6,200 crore in the construction of a cutting-edge semiconductor packaging facility in Madhya Pradesh...- Advanced chipmaking tool arrives at New York state innovation hubA significant chipmaking tool from ASML has arrived in New York. This advanced equipment will drive research into future chip designs and m...
- Saudi Arabia introduces one-year multiple-entry Umrah visaSaudi Arabia has launched a new one-year multiple-entry Umrah visa for pilgrims. This visa allows a cumulative stay of up to ninety days wi...
- TSMC expects 'strong, multi-year' demand for AI chips as it ramps up Arizona investmentSpeaking after blockbuster second-quarter results on Thursday, Chief Financial Officer Wendell Huang said the company is "very happy" with ...
- PTC Industries bags two-year BrahMos missile subsystem orderPTC Industries has secured a two-year order from BrahMos Aerospace. This order involves developing and integrating a strategic missile subs...
- Haryana: Security stepped up in Bahadurgarh ahead of PM Modi's visit; 160 personnel deployed, says ACPPrime Minister Narendra Modi will inaugurate India's first hydrogen-powered train on Friday. This marks a significant step in the nation's ...
- Snowflake unveils $448 million pay plan for CEO tied to ambitious stock targetsRamaswamy's award, totaling 1 million shares, is structured into five tranches, each with escalating stock price milestones, and is desig...
- Global Market: TSMC to invest additional $100 billion in Arizona, raises capex on booming AI demandTSMC will invest an additional one hundred billion dollars in Arizona facilities. This expansion underscores strong confidence in future ar...
- TSMC to invest another $100 billion in US as Q2 profit blows past forecastsTSMC will invest an additional $100 billion in Arizona, expecting robust AI demand. The company raised its capital spending forecast signif...
- Cadence rolls out AI agent to speed circuit board, chip packaging designThe tool, called AuraStack, lets engineers describe their goals in plain language, then plans and carries out the work using Cadence's exi...
- NPCIL-NTPC JV to invite bids for ₹28,000 crore Rajasthan nuclear projectIn a significant step towards bolstering India's nuclear infrastructure, Anushakti Vidhyut Nigam Ltd will shortly invite bids for a crucial...
- India can import capital, but not sovereignty; controlling silicon critical for future: ESSCI CEOIndia's shift towards semiconductor manufacturing represents a crucial strategy for asserting national autonomy. By fostering local chip pr...
- Government approves Rs 1.27 lakh crore ISM 2.0, expects Rs 4 lakh investmentsThe government expects ISM 2.0 to bring in investments worth Rs 4 lakh crore, production worth Rs 2 lakh crore and exports of Rs 1 lakh cro...
- Cabinet approves India Semiconductor Mission 2.0; earmarks Rs 1.27 lakh crore for the projectThe Union Cabinet approved India Semiconductor Mission 2.0 with significant funding. A Rs 62,500 crore Mobile Phone Manufacturing Scheme wa...
- Samsung, SK hynix, Micron ramp up capacity as demand for AI infrastructure outpaces supplyGlobal memory chipmakers are expanding production capacity to meet AI demand. Samsung, SK Hynix, and Micron are investing billions in new f...
- India sweetens the deal for global electronics manufacturersIndia is enhancing its electronics manufacturing capabilities by extending customs duty relief. This policy aims to boost domestic producti...
- TSMC to add 2 advanced chip packaging plants in Chiayi, Taiwan minister saysLocated in southern Taiwan, the Chiayi Science Park is being developed as one of TSMC's major advanced chip-packaging hubs.
- Polymatech plans listing, $500-600 million push for semiconductor expansionThe company is in talks with merchant bankers and intends to proceed with its public offering plans “as early as possible”, Nandam said, ad...
- Tata's Assam semiconductor plant to receive Rs 14,044 crore in government incentivesThe Tata Group's new Assam semiconductor facility will receive significant government incentives. The Centre will provide Rs 10,255 crore, ...
- Rainmatter leads Rs 40 crore funding in sustainable packaging startup EconovusEconovus Packaging has secured Rs 40 crore in a funding round led by Rainmatter. This capital will establish a manufacturing facility and a...
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