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CHIP PACKAGING DESIGN
Cadence rolls out AI agent to speed circuit board, chip packaging designThe tool, called AuraStack, lets engineers describe their goals in plain language, then plans and carries out the work using Cadence's exi...
India can import capital, but not sovereignty; controlling silicon critical for future: ESSCI CEOIndia's shift towards semiconductor manufacturing represents a crucial strategy for asserting national autonomy. By fostering local chip pr...
Semicon 2.0 adopts complete semiconductor ecosystem approach for first time: HCL cofounder Ajai ChowdhryIndia's Union Cabinet approved Semicon 2.0 and the Mobile Phone Manufacturing Scheme. These initiatives adopt a complete ecosystem approach...
Semicon 2.0, PLI could create up to 20 lakh direct and indirect jobs: ICEAThe Union Cabinet's approval of the Semicon 2.0 programme and the Mobile Phone Manufacturing Scheme (MPMS) could generate up to 5 lakh dire...
Government approves Rs 1.27 lakh crore ISM 2.0, expects Rs 4 lakh investmentsThe government expects ISM 2.0 to bring in investments worth Rs 4 lakh crore, production worth Rs 2 lakh crore and exports of Rs 1 lakh cro...
Cabinet highlights: India clears Rs 2.19 lakh crore mega push across chips, corridors and mobile manufacturingThe Cabinet approved Semicon 2.0 with a Rs 1,27,500 crore outlay for chip manufacturing. A Rs 62,500 crore scheme will boost mobile phone m...
Cabinet approves India Semiconductor Mission 2.0; earmarks Rs 1.27 lakh crore for the projectThe Union Cabinet approved India Semiconductor Mission 2.0 with significant funding. A Rs 62,500 crore Mobile Phone Manufacturing Scheme wa...
Global Market: SK Hynix warns of historic memory chip shortage by 2027 as AI demand soarsSK Hynix anticipates a severe global memory chip shortage extending beyond 2030. Accelerating artificial intelligence infrastructure demand...
TSMC to add 2 advanced chip packaging plants in Chiayi, Taiwan minister saysLocated in southern Taiwan, the Chiayi Science Park is being developed as one of TSMC's major advanced chip-packaging hubs.
Polymatech plans listing, $500-600 million push for semiconductor expansionThe company is in talks with merchant bankers and intends to proceed with its public offering plans “as early as possible”, Nandam said, ad...
Tata's Assam semiconductor plant to receive Rs 14,044 crore in government incentivesThe Tata Group's new Assam semiconductor facility will receive significant government incentives. The Centre will provide Rs 10,255 crore, ...
iPhone 18 Pro Max: Launch date, design, camera upgrades, AI features & everything Apple could unveiliPhone 18 Pro Max: Apple is expected to unveil the iPhone 18 Pro and iPhone 18 Pro Max in September 2026. According to reports, the devices...
India's semiconductor push faces execution challenges, over 90% chip equipment still imported: ReportWhile India is building domestic capabilities in chip fabrication, packaging and testing, execution remains its biggest challenge due to he...
India's Semicon 2.0: Government expands incentives for semiconductor ecosystem beyond fabricationIndia is finalizing Semicon 2.0, expanding incentives beyond chip fabrication. This new phase will support the entire semiconductor value c...
India's hidden semiconductor advantage: What's next in the chip journey?As India accelerates its semiconductor ambitions with a proposed second-phase incentive programme, Equirus says the country is well positio...
CG Semi’s Gujarat chip unit starts to shipThis marks a new milestone in India’s mission to create an ecosystem for semiconductor manufacturing and assembling, which began from scrat...
India's chip dreams get a Rs 1.25 lakh crore push with Semiconductor Mission 2.0India is significantly boosting its semiconductor ambitions with a Rs 1.25 lakh crore allocation for India Semiconductor Mission 2.0, a sub...