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ASSAM SEMICONDUCTOR PACKAGING UNIT
Assam CM Himanta writes to PM Modi on historic milestone, credits him for transforming state's destinyAssam Chief Minister Himanta Biswa Sarma congratulated Prime Minister Narendra Modi on his record tenure. Sarma presented a letter from Ass...- India emerges as global tech partner under PM Modi's 12-yr tenure, exporting to US, China: VaishnawIndia is now a trusted partner in technology value chains. Under Prime Minister Narendra Modi, the country exports electronics, including c...
- Samsung Electronics considers building chip packaging plant: ReportSamsung is expected to unveil the investment plan at a meeting between South Korean President Lee Jae Myung and the heads of the country's ...
- SEZ import relief to fast track chip projectsIndia's semiconductor manufacturing sector is set for a major boost. New rules exempt imports for Special Economic Zones from quality check...
- Modi, Japan PM Sanae Takaichi may hold talks in Guwahati: HimantaGuwahati may host summit-level talks between Prime Minister Narendra Modi and Japanese Prime Minister Sanae Takaichi. Assam is seeking Japa...
- Assam govt, EU delegation welcome successful launch of Blue Valley ClusterAssam and the European Union have launched the Blue Valley Cluster in Guwahati. This initiative focuses on Flavours, Fragrance and AYUSH se...
- Samsung Electronics considers building chip packaging plantSamsung Electronics is exploring a significant investment in Gwangju, South Korea. The company is considering a new advanced semiconductor ...
- Assam CM Himanta Biswa Sarma meets 'Team Europe' delegation to boost trade, investment linkagesAssam Chief Minister Himanta Biswa Sarma met the "Team Europe" EU delegation to boost trade and investment. The two-day visit focuses on se...
- Infineon taps CDIL, Kaynes to strengthen India chip collabGerman chipmaker Infineon Technologies is expanding its engagement with India's semiconductor manufacturing ecosystem by partnering with CD...
- Chip startup AGNIT sets up GaN testing lab at IISc with Rs 3 crore investmentIndian semiconductor startup AGNIT Semiconductors has established a new GaN testing laboratory at IISc Bengaluru. This facility, built with...
- Comparing India with Taiwan, South Korea on semiconductors not very accurate: Union minister VaishnawIndia is rapidly advancing in semiconductor manufacturing and AI adoption. Union Minister Ashwini Vaishnaw highlighted significant progress...
- World's most advanced chips, including Nvidia chips, being designed in India: Union minister Ashwini VaishnawIndia is now designing advanced semiconductor chips for global leaders like Nvidia and Intel. Over 300 universities are teaching chip desig...
- India can win in AI deployment despite lagging in advanced chips: Neelkanth MishraIndia can create significant economic value by deploying artificial intelligence to solve real-world problems in healthcare, education, and...
- Team Europe to visit Assam on June 8-9 to launch India's first Blue Valley clusterGuwahati, Assam, is preparing to welcome a distinguished European Union delegation on June 8-9, as part of a mission to strengthen ties bet...
- Europe's tech 'liberation day'? Computer says not yetThe EU plan aims to boost European tech firms and limit some access for dominant U.S. rivals. It marks a key but initial step, with the blo...
- Chip Camp looks to build talent for India’s next-gen semicon engineersFounded by Sanchit Kulkarni and Himanshi Sonava, it makes hardware engineering accessible through free resources, mentorship, and practical...
- Semiconductor plant in Assam likely to start production this fiscal, Union Minister Ashwini Vaishnaw saysProduction at the Jagiroad semiconductor plant in Assam is set to begin this financial year. Union Minister of I&B and Electronics and IT, ...
- Intel, 3DGS sign $3.3-billion Odisha semiconductor MoUA significant investment of $3.3 billion is set to boost India's semiconductor ecosystem. Intel, Odisha government, and 3D Glass Solutions ...
- India's semiconductor push gets major boost with $3.3 bn Odisha deal with Intel & 3D Glass SolutionsOdisha, Intel and 3D Glass Solutions Inc. signed an agreement for a new advanced packaging glass core substrate manufacturing facility. Thi...
- Tata Electronics plans to start chip packaging at upcoming Assam unitWhile the Tata Group company has already initiated small-scale shipments from its first commercial OSAT facility in Vemagal, Karnataka, the...
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