MediaTek hires former TSMC executive to boost AI chip packaging

Taiwanese chip designer MediaTek said it has appointed former TSMC executive Douglas Yu as a part-time adviser as it steps up advanced packaging work and expands into the AI ‌chip market.

Yu joined TSMC in 1994 and retired in 2025, holding a range of roles in backend research and development. He played a key part in developing TSMC's advanced packaging technologies, including its CoWoS (Chip on ⁠Wafer on ‌Substrate).

CoWoS is a key chip packaging technology widely used in artificial ⁠intelligence chips, including Nvidia chips.


"We look forward to leveraging his extensive industry experience and technical expertise to support the company's exploration and roadmap planning for future advanced packaging technologies, as well as to guide our R&D and investment strategy in ‌advanced packaging-related products and technologies associated with TSMC," MediaTek said in a statement on Saturday.

TSMC's ⁠CoWoS capacity has been in high demand, with customers such as Nvidia and cloud service providers scrambling to secure capacity.

Last week, MediaTek said it expects to generate multiple billions of dollars in revenue from its AI accelerator ASIC chips by 2027.