The India Semiconductor Mission (ISM) has approved ten semiconductor units, which will all receive central and state government subsidies under the programme for the development of semiconductors and the display manufacturing ecosystem in India.
The total approved projects' cumulative investments have reached around Rs 1.6 lakh crore in six Indian States.
ET provides a quick reckoner of the ten units along with those in the pipeline.
The other approved projects are:
Kaynes Semicon
To set up an OSAT (Outsourced Semiconductor Assembly and Testing)
Location: Sanand, Gujarat
Investment: Rs. 3,307 crores
Capacity: 63 lakh chips per day
Land: 46 acres
Kaynes' investment: 30% (Rs. 992.1 crore)
To roll out chips by 2025
Initial production: 200 million chips per annum
Target: 1 billion chips per annum within 5 years
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HCL-Foxconn
Investment: Rs 3,706 crore
To set up: OSAT in Jewar, Uttar Pradesh
To produce: Display driver chips
For smartphone ecosystem in India
SiCSem & Clas-SiC Wafer Fab
Investment: Rs 2,066 crores
To set up: Silicon carbide (SiC)-based compound semiconductor unit
Location: Bhubaneswar, Odisha
To be first commercial compound fab in India
Annual capacity: 60,000 wafers & a packaging capacity of 96 million chips
Applications: In missiles, defence equipment, electric vehicles (EVs), railway, fast chargers, data centre racks, consumer appliances, & solar power inverters.
3D Glass Solutions Inc.
To set up: Vertically integrated advanced packaging and embedded glass substrate unit
Investment: Rs 1,943 crores
Location: Bhubaneswar
Investors: Intel, Lockheed Martin, private equity investors, venture capital firms
Planned capacity: 69,600 glass panel substrates, 50 million assembled units, & 13,200 3DHI modules per annum.
Applications: in mobile phones, set-top boxes, automobile applications, data centers, high speed communications & AI applications
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Continental Device India Private Limited (CDIL)
Location: Mohali, Punjab
Investment: Rs 117 crore
To manufacture: MOSFETs, IGBTs, schottky bypass diodes, transistors
Annual capacity: 158.38 million units.
Applications: In automotive electronics, EVs & its charging infrastructure, renewable energy systems, power conversion applications, industrial applications & communication infrastructure
Projects pending ISM approval:
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Crystal Matrix MicroLED display fab in partnership with Lumens Co. (South Korea)
Investment: Rs. 3,000 crores
Land: 50 acres
Purpose: Cutting-edge microLED display facility
Location: Telangana
What it includes: Integrated gallium nitride (GaN) foundry; OSAT; ATMP lines
Target: 2,000 wafers (six inch and above) per month
Tarq Semiconductors, owned by real estate giant Hiranandani Group
Investment: Rs 28,440 crore
Purpose: Semiconductor fab project
Location: Greater Noida (YEIDA region)
What it will manufacture: Advanced semiconductor materials (GaN, silicon carbide (SiC), Gallium Arsenide (GaAs), silicon photonics for electronics, automotive sectors
Financial incentives: Rs 7,037.5 crore from UP Govt
RRP Electronics and HorngCom Technology
HorngCom will assign a range of OSAT services, integrated circuit products to be handled at the RRP Electronics facility.
These include SIM cards and modules, NAND memory chips, MOSFET components, other IC related products.
Following a technical review of RRP’s facility in Mumbai, HorngCom Technology, a division of AMB Taiwan, had announced a collaboration with RRP Electronics.
HorngCom’s technical team had evaluated RRP’s semiconductor plant at Mahape; cleared it for assignments from HorngCom Taiwan.
Level 1 of RRP Electronics’ OSAT facility will include a new production line to handle additional workload.
