CDIL Semiconductors signs MoU with Infineon Technologies

CDIL Semiconductors on Thursday said it has signed a Memorandum of Understanding (MoU) with Infineon Technologies Asia Pacific, which specialises in power systems and IoT, to explore strategic collaboration opportunities in India’s semiconductor market.

Through this collaboration, the companies said Infineon will supply high-performance bare die wafers to CDIL, which will package them into discrete and module semiconductor products tailored for Indian customers. They said the goal was to strengthen India’s domestic capabilities and global supply chain position to ensure a cost-optimised, locally integrated supply.

“By integrating Infineon’s world-class wafer technology with CDIL’s advanced OSAT capabilities, we are setting new benchmarks in innovation and localisation. This collaboration goes beyond growth — it drives innovation, accelerates ‘Make in India,’ and positions India as a hub for semiconductor excellence,” Pankaj Gulati, President, CDIL said in a statement.


The companies added that they will address critical semiconductor needs in various sectors automotive and mobility, power semiconductors and renewable energy as well as industrial and consumer applications.

“Through this collaboration, we will be delivering cutting-edge power semiconductor products and solutions to customers that address the growing needs in e-mobility, renewable energy, and energy-efficient appliances in India,” Richard Kuncic, Senior Vice President & General Manager Power Systems at Infineon Technologies said.