Cabinet approves India-Japan semiconductor cooperation pact

The Union Cabinet on Wednesday approved the memorandum of cooperation (MoC) signed between India and Japan to co-develop semiconductor supply chains, the government said.

The MoC, signed between the two countries in July this year, also intends to focus on active cooperation between the two countries on efficient semiconductor design, fabrication and manufacturing of chips designed in both countries, research and development of equipment used in semiconductor ecosystem development, as well as high-quality talent development.

“The MoC intends to strengthen cooperation between India and Japan towards enhancement of semiconductor supply chain, recognising the importance of semiconductor for the advancement of industries and digital technologies,” the government said in the statement.


In July, after the signing of the MoC, the union minister for electronics and information technology Ashwini Vaishnaw had said that India and Japan had “complimentary strength” which would be mutually beneficial to both the countries.

“Japan has strengths in the silicon wafer and ingot manufacturing, raw materials such as gasses, display and equipment manufacturing. They see India as a partner where complementary strengths can be used,” Vaishnaw had then said.

The MoC, signed in July and approved on Wednesday by the Cabinet, will remain in force for five years.