Qualcomm tapes out 2-nanometre chip design from India; Ashwini Vaishnaw sets fabs as next frontier
Tape-out is the point at which a chip’s final design is completed, and it is sent to a fabrication facility for manufacturing. This milestone moment follows the government’s recent announcement of the India Semiconductor Mission 2.0 in its Union B...
By ETtech |
American chipmaker Qualcomm Technologies announced on Saturday that it has completed the tape-out of its 2-nanometre semiconductor design at its Bengaluru Development Centre.
Tape-out is the stage where a chip’s final design is completed and sent to the fabrication plant for manufacturing.
This marks a major global milestone and underscores India’s growing role in advanced chip engineering.
Union electronics and IT minister Ashwini Vaishnaw, who was also present at the facility during the showcase, lauded the achievement and added that the next target would be to build 2-nanometre fabs in India.
This comes as the government recently announced the India Semiconductor Mission 2.0 in its Union Budget 2026.
“This milestone is the outcome of over two decades of sustained effort in India. While the global industry works toward the next generation of advanced nodes, Team Qualcomm is already demonstrating what is possible,” wrote the company’s India president, Savi Soin, in a post on LinkedIn.
India currently hosts Qualcomm’s largest engineering workforce outside the US, with teams contributing across the chip lifecycle, including design implementation, validation, system integration, and artificial intelligence (AI) optimisation.
Meanwhile, Qualcomm’s president and CEO, Cristiano R Amon, will be one among the many keynote speakers at the India AI Impact Summit. The summit is scheduled to be held from February 16 to February 20.
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