US Dept of State rolls out $200 mln push to expand secure smartphones in Indo-Pacific

The U.S. Department of State on Thursday announced a contest to award up to $200 million in foreign assistance funding to support the deployment of secure, high-quality and affordable handheld smartphones across the Indo-Pacific region, aimed at strengthening the market position of next-generation devices in the region.

Also Read: US under Secy Jacob Helberg to visit India for AI Summit; Delhi set to join 'Pax Silica'

This initiative advances the Pax Silica vision of a dynamic, interconnected Indo-Pacific by equipping millions with AI-driven development tools to foster innovation and entrepreneurship.


India is expected to join Pax Silica in February 2026, a move being described as a potential “historic milestone.” With its vast talent pool, expanding semiconductor ambitions and strategic geographic position, New Delhi is likely to secure a place in shaping what officials call the “architecture of the 21st century.”




What is Pax Silica?

Pax Silica is a U.S.-led economic and technology coalition launched in Washington on December 12, centred on securing supply chains in semiconductors, critical minerals and energy for the AI era.

The initiative seeks to deepen cooperation across the technology value chain — from raw materials and chipmaking to AI infrastructure — while strengthening economic resilience among member countries.

U.S. officials say the framework is designed to reduce overdependence, eliminate supply chain vulnerabilities and promote trusted technology ecosystems.

Nine countries have joined so far: Australia, Israel, Japan, South Korea, Qatar, Singapore, United Kingdom, United Arab Emirates and Greece.