Huawei, Intel tie up to bring IT solutions for global market

BEIJING: Chinese telecom equipment maker Huawei today announced signing of an agreement with Intel to cooperate in enhancing engineering efforts and bringing new IT solutions to the market.

The collaboration will include enhancing engineering cooperation and building competitive products and solutions for server, storage, data centre and cloud computing as well as jointly going to market in China and other geographic areas.

"Huawei has strong capability in server, storage, data centre and cloud computing. The strategic global cooperation MoU on IT will...allow us both to innovate around customer demand" President of Huawei IT product line Zheng Yelai said in a statement.

The aim of this MoU is to strengthen and highlight the continued focus on server, storage, data centre and cloud computing products, and to share market development efforts, synchronise future strategies and shorten product development cycles, the statement said.

"The key advantage for both companies is the ability to bring new innovative product and usage models to market," Intel corporate vice president and China president Ian Yang said.