Rs 27,000 cr semiconductor hub to create 27,000 jobs in Assam, says N Chandrasekaran; Ratan Tata sends best wishes
Tata Sons Chairman N Chandrasekaran has conveyed Ratan Tata's best wishes for the new chip assembly plant in Assam. This Rs 27,000 crore facility, set to become operational by 2025, will create over 27,000 jobs. The project aligns with the Governm...

Chandrasekaran highlighted the plant's substantial impact on employment. "At its capacity it will employ 27,000 people, 15,000 direct jobs and additional 12,000 indirect jobs. We want to move fast. We are trying to accelerate the building of this factory. We hope sometime in 2025 we will be able to complete this facility and quickly start operations," he said. The plant will not only provide high-end job opportunities but will also foster skill development and create a semiconductor ecosystem in the region.
Government Support and Regional Development
The Bhumi Pujan ceremony, marking the start of the construction, was attended by Assam Chief Minister Himanta Biswa Sarma. Sarma described the day as a "golden day" for Assam, emphasizing the significance of the project for regional industrial development. "The setting up of this facility will herald industrial development in the state leading to employment opportunities for the youth," Sarma said. He assured full support from the state government and highlighted the investment's potential to accelerate industrial progress and create job opportunities for local youth.
Technological Focus and Industry Impact
The new Tata Electronics plant will concentrate on three key platform technologies: Wire Bond, Flip Chip, and a differentiated offering called Integrated Systems Packaging (ISP). Future expansions will include advanced packaging technologies. This facility is expected to benefit various industries, including automotive, particularly the electric vehicle sector, communications, and network infrastructure. Semiconductor assembly and testing are critical processes in the semiconductor value chain, involving the packaging and testing of wafers before they are used in final products.
Alignment with National Policies
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