iPhone 15 Pro's 'curved design' to feature thinner bezels, USB-C port & thicker camera bump, reveal leaked renders

With every new year, come new expectations from Apple as it prepares to release the iPhone of the year.

This year, all eyes are on the iPhone 15 series, which has been rocking the tech world with rumours and speculations. So far we already know that the upcoming iPhone 15 series will be going through a makeover and receiving fresh designs from Apple.

While the reports about Apple smartphone receiving a camera bump to house its 48MP camera (a first for iPhones!) is no longer a new piece of information, 9to5Mac has shared exclusive renders of the upcoming device which give us a closer look and reveal more key details.


The renders reveal some crucial changes to iPhone 15 Pro's design, as per the report. The render of iPhone 15 Pro has been created by Ian Zelbo, 3D artist, which were then shared with 9to5Mac.

As per the renders, we can expect some changes to the speaker holes at the bottom of the smartphones in iPhone 15 line-up. The upcoming smartphones from Apple will house a USB-C port.
The iPhone 15 Pro will flaunt thinner bezels than the ones on iPhone 14 Pro, as per the report. The smartphone will also reportedly receive a minor change to the curve of the edge.

According to the images, the iPhone 15 Pro's frame will be slightly more curved with the glass curving into the edges. While it's a subtle change, it will still be noticeable.

The renders further show that the camera bump on the premium phone in the iPhone 15 series will flaunt a thicker layout than the iPhone 14 camera bump. So we can expect the camera lens on the iPhone 15 Pro to be a little bit thicker.

As per reports, the iPhone 15 Pro is expected to come with a unique periscope lens.

Meanwhile, the Cupertino-based tech giant is also planning on launching the upcoming 15-inch MacBook Air with an M2 chip.

The laptop is expected to be released in the second quarter of this year, which runs from April to June, according to MacRumors.