Xiaomi launches new Xring chip, partners with TSMC for production, sources say
Xiaomi introduced its new Xring O3 smartphone processor, aiming for greater component control. This chip, made by TSMC using its 3nm technology, targets future flagship devices. The company expects to ship between 200,000 and 300,000 units of this...
The introduction of Xring O3 comes a year after Xiaomi launched its first proprietary smartphone processor, the Xring O1, marking the latest step in the world's third-largest smartphone vendor's push to join rivals such as Apple, Samsung Electronics and Huawei in developing its own chips.
TSMC will manufacture the new chip using its 3-nanometre production technology, two people familiar with the matter said.
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One of the sources said the chip is expected to power Xiaomi's upcoming flagship folding phone, with a shipment target of 200,000 to 300,000 units.
The people declined to be identified because the plans are not public. Xiaomi and TSMC did not immediately respond to requests for comment on the chip's manufacturer, production technology or shipment targets.
Smartphone processors, or system-on-chips (SoC), integrate computing, graphics, AI processing and imaging functions into a single component.
Xiaomi's chip push reflects a broader industry trend as device makers seek to differentiate products and lessen dependence on suppliers such as Qualcomm and MediaTek amid intensifying competition in premium smartphones.
Xiaomi said during an earnings call last week that cumulative shipments of devices powered by the Xring O1, including smartphones, tablets and watches, had surpassed 1 million units since its launch.
Xiaomi has sold about 150,000 smartphones based on the Xring O1 chip since its May 2025 launch, according to the sources.
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