Sahasra to invest Rs 350 cr to step up semiconductor packaging

Noida-based Sahasra Electronics plans to spend about ₹350 crore in the next three years to step up manufacturing under the 'Make in India' programme and set up a semiconductor packaging facility, said Sahasra Group chairman Amrit Manwani.

"We will be investing over ₹350 crore in a three-year period for semiconductor packaging, and have become one of the first Indian companies to do semiconductor packaging in this fiscal year," Manwani told ET. Packaging is a significant facet of semiconductor manufacturing and design, and the wafers' packaging - whether plastic, metal, glass or ceramic - protects them from chemical contamination and damage from light or impact of heat.