Made-in-India chips to hit market by 2025-end for first time, says PM Modi

PM Modi on Friday announced that India’s first fully made-in-India semiconductor chip will hit the market by the end of this year. Speaking during his 79th Independence Day address from the Red Fort, the prime minister said six semiconductor units are already operational, while four new units have received government approval.

“By the end of this year, made in India, made by the people of India, made in India chips will come to the market,” he said, highlighting the country’s push to achieve self-reliance in this critical technology sector.

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"My dear youth, you will be surprised to know that today, the semiconductor, which has become the strength of the world, 50-60 years ago, that thought process, those files, got stuck. They got stuck. The thought process of the semiconductor itself was foeticide 50-60 years ago. It lost 50-60 years. After us, many countries, in semiconductors, today, have mastered the technology and consolidated their power," he added.

Semiconductors, vital components for devices ranging from mobile phones and computers to electric vehicles and home appliances, are expected to see India’s market grow from $45-50 billion in 2024-25 to $100-110 billion by 2030, according to industry estimates.

India moves forward in mission mode

The PM recalled that India’s semiconductor journey started over 50 years ago but remained stalled for decades while other countries dominated the industry. “The thought process for semiconductors existed 50-60 years ago, but the files got stuck. Today, several countries have mastered the technology and consolidated their power,” he said, urging the youth to learn from this history.

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He noted that the government is no longer burdened by the past and is pursuing semiconductors in a mission mode, focusing on rapid growth and technological independence.

New projects & investments

The Union Cabinet recently approved four new semiconductor plants with a total investment of Rs 4,594 crore across Odisha, Andhra Pradesh, and Punjab.

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Notable projects include:

• A 3D glass semiconductor packaging unit by 3D Glass Solutions Inc backed by Intel, Lockheed Martin, and Applied Materials, with a production capacity of 5 crore units annually.
  
• India’s first commercial silicon carbide (SiC) fabrication unit by SiCsem in Bhubaneswar, capable of producing 9.6 crore chips per year.
  
• A chip packaging plant by Advanced System in Package Technologies in Andhra Pradesh, with an annual capacity of 9.6 crore units.
  
• A semiconductor project by CDIL in Punjab with an annual output of 15.8 crore units.